Tender Details
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| Particulars | Details |
|---|---|
| Title |
Custom Bid For Services Semiconductor Bga Package Manufacturability Validation Of Flip Chip Bump
|
| Description |
|
| Organisation | Department of Electronics and Information Technology | Ministry of Electronics and Information Technology |
| Tender Id | GEM/2024/B/4712910 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://bidplus.gem.gov.in/all-bids |
| Start Date | February 29, 2024 22:30 |
| End Date |
Expired
11/03/2024
Expired 949 days ago |
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Tender Status:
active
Additional Information:
Average Turn Over of Last 3 Years: Lakhs
Experience with Gov. Required: Years
Project Experience Required: No
Buyer Name:
Dhanya
Ministry:
Ministry Of Electronics And Information Technology
Department:
Department Of Electronics And Information Technology
Organisation:
Centre For Development Of Advanced Computing (c-dac)
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