Flip Chip Bonder
Department of Higher Education | Ministry of Education
This tender closed on 08 Jan 2025. 5 tenders like it are open now.
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Wooden chips work
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SUPPLY, INSTALLATION and COMMISSIONING Of Semi Auto Wire Bonder
Bharat Electronics Limited | Bangalore Unit - BEL | COMP - BEL | Purchase-COMP - BEL · Karnataka Closes 12 Nov 2026
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Earthing and Bonding System
For complete description and other details, please refer to tender document.
Ministry of Railways Closes 4 Jan 2027
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Supply of retreading material bonding gum
The Institute of Road Transport | Central Purchase Unit · Tamil Nadu Closes 17 Nov 2026
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Tender details
- Tender ID
- GEM/2024/B/5723900
- Reference number
- –
- Organisation
- Department of Higher Education | Ministry of Education
- Location
- –
- Bids open
- 18 Dec 2024, 5:22 PM
- Bids close
- 8 Jan 2025, 6:00 PM
- Tender value
- –
- EMD
- –
- Tender fee
- –
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