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| Particulars | Details |
|---|---|
| Title |
Flip Chip Bonder System
|
| Description |
|
| Organisation | Department of Defence Research & Development | Ministry of Defence |
| Tender Id | GEM/2025/B/6568706 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://bidplus.gem.gov.in/all-bids |
| Start Date | August 14, 2025 20:47 |
| End Date |
Expired
03/09/2025
Expired 407 days ago |
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Tender Status:
active
Ministry:
Ministry Of Defence
Department:
Department Of Defence Research & Development
Organisation:
Office Of Dg ( Med & Cos)
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