Tender Details
| Particulars | Details |
|---|---|
| Title |
Flip Chip Bonder
|
| Description |
Flip Chip Bonder
|
| Organisation | Department of Higher Education | Central Govt. Ministry/Department |
| Tender Id |
AAAAAAAAAA Login to view |
|
Reference Number |
AAAAAAAAAA Login to view |
| Tender Fee | 0 |
| EMD | 0 |
| Tender Value | |
| Place | Electrical Engineering Department IIT Bombay |
| Link |
AAAAAAAAAA Login to view |
| Start Date | April 01, 2025 22:00 |
| End Date |
30/04/2025 ( 6 days left ) Search Similar tenders? |
|
Join for More Relevant Opportunities |
Similar Tenders
Personal mobile(fold),personal laptop(m3 chip),personal laptop(intel core ultra 5),personal mobile
Read more
Laptop 13.6 incc(diagonal) backlit display with ips technology, m4 chip with 10 core cpu and 8 core
Read more
Click
Here to Download Dockets
of your Industry type
of your Industry type