Tender Details
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| Particulars | Details |
|---|---|
| Title |
Flip Chip Bonder
|
| Description |
Flip Chip Bonder
|
| Organisation | Department of Higher Education | Central Govt. Ministry/Department |
| Tender Id | 2025_DoHE_793871_1 |
|
Reference Number |
6100002078 |
| Tender Fee | 0 |
| EMD | 0 |
| Tender Value | - |
| Place | Electrical Engineering Department IIT Bombay |
| Link |
View Original Tender Notice
https://eprocure.gov.in/epublish/app?page=FrontEndTenderDetailsExternal&service=page&tnid=1098370 |
| Start Date | April 01, 2025 22:00 |
| End Date |
Expired
30/04/2025
Expired 536 days ago |
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