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| Particulars | Details |
|---|---|
| Title |
12776 Universal Bond Adhesive, 8 Th Generation , No Etching System Multipurpos E Liquid Contains : 1)tertiary Butanol Solvent Hyhilic In Nature,
2)compatible With Both Light Cure & Dual Cure Material
3)film Thickness 8 Micron
4) Universal Bond With Total Etch, Self Etch And Selective Etch Property
5) Working Time 30 Mins. Packaging 4 Ml
|
| Description |
For Complete Deion And Other Details, Please Refer To Tender
|
| Organisation | Ministry of Railways | Central Govt. Ministry/Department |
| Tender Id | 106551904 |
|
Reference Number |
H1242903 |
| Tender Fee | 0 |
| EMD | 0 |
| Tender Value | - |
| Place | Mumbai CST |
| Link |
View Original Tender Notice
https://www.ireps.gov.in/ireps/supply/pdfdocs/122024/106551904/viewNitPdf_4803927.pdf |
| Start Date | December 12, 2024 22:16 |
| End Date |
Expired
21/12/2024
Expired 665 days ago |
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12776 - universal bond adhesive , no etching system multipurpos e liquid
12776 - universal bond adhesive , no etching system multipurpos e liquid
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Read more12776 - universal bond adhesive , no etching system multipurpos e liquid
For complete deion and other details, please refer to tender
Read more12776 - universal bond adhesive , no etching system multipurpos e liquid
For complete deion and other details, please refer to tender
Read more12776 - universal bond adhesive , no etching system multipurpos e liquid
For complete deion and other details, please refer to tender
Read moreUniversal bond adhesive , no etching system multipurpos e liquid
For complete deion and other details, please refer to tender
Read moreUniversal bond adhesive , no etching system multipurpos e liquid
For complete deion and other details, please refer to tender
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