Electronics Corporation of India Limited
Results for: Electronics Corporation of India Limited
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1. supply of paliney-7 contact size: 300mm plus or minus 3.175mm x1.0 mm long plus or minus 0.01mm diameter temper: ductile heat treated technical specification as per annexure-a. 2. supply of paliney-7 contact strip material: paliney-7 temper: stress relived size: 25.4mm width plus or minus 0.051mm x 0.05 plus or minus 0.0076mm thick x 300 plus or minus 3.175mm long. technical specification as per annexure-a.
1. supply of paliney-7 contact size: 300mm plus or minus 3.175mm x1.0 mm long plus or minus 0.01mm diameter temper: ductile heat treated technical specification as per annexure-a. 2. supply of paliney-7 contact strip material: paliney-7 temper: stress relived size: 25.4mm width plus or minus 0.051mm x 0.05 plus or minus 0.0076mm thick x 300 plus or minus 3.175mm long. technical specification as per annexure-a.
Tender EMD: 33000
Tender Fee: 0
Organisation: Electronics Corporation of India Limited | Public Sector Undertakings
Start Date: June 29, 2024 16:59
Place: Hyderabad
Due Date:
Expired 345 days ago
Supply of rtu scm module includes pcb fabrication, material procurement and component assembly as per annexure t1 and preliminary testing atp as per annexure-t2. qty: 10 no s to ecil-hyderabad.
Supply of rtu scm module includes pcb fabrication, material procurement and component assembly as per annexure t1 and preliminary testing atp as per annexure-t2. qty: 10 no s to ecil-hyderabad.
Tender EMD: 0
Tender Fee: 0
Organisation: Electronics Corporation of India Limited | Public Sector Undertakings
Start Date: November 04, 2024 21:50
Place: Hyderabad
Due Date:
Expired 223 days ago
Design, fabricate, supply, install and commissioning prepreg vacuum conditioning system at pcb. lab oven shall be used for removal of moisture content from prepregs used for printed circuit board fabrication as per rfq.
Design, fabricate, supply, install and commissioning prepreg vacuum conditioning system at pcb. lab oven shall be used for removal of moisture content from prepregs used for printed circuit board fabrication as per rfq.
Tender EMD: 20000
Tender Fee: 0
Organisation: Electronics Corporation of India Limited | Public Sector Undertakings
Start Date: February 01, 2024 22:16
Place: Hyderabad
Due Date:
Expired 495 days ago
Fabrication and supply of trolley along with 15mm thick high density poly ethylene (hdpe) sheet top as per drg. no. 0108-502988-3b & metal frame partitions as per drg. no. 0108-502993-4b.
Fabrication and supply of trolley along with 15mm thick high density poly ethylene (hdpe) sheet top as per drg. no. 0108-502988-3b & metal frame partitions as per drg. no. 0108-502993-4b.
Tender EMD: 17325
Tender Fee: 0
Organisation: Electronics Corporation of India Limited | Public Sector Undertakings
Start Date: August 22, 2024 20:58
Place: Hyderabad
Due Date:
Expired 292 days ago
Supply of housing base, housing cover, matrix plate, din rail etc., make: phoenix contact only as per phoenix contact part no s, qty and technical specifications mentioned in annexure-t1 to ecil-hyderabad.
Supply of housing base, housing cover, matrix plate, din rail etc., make: phoenix contact only as per phoenix contact part no s, qty and technical specifications mentioned in annexure-t1 to ecil-hyderabad.
Tender EMD: 0
Tender Fee: 0
Organisation: Electronics Corporation of India Limited | Public Sector Undertakings
Start Date: January 07, 2025 16:55
Place: Hyderabad
Due Date:
Expired 157 days ago
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