Results for: Die Bonder

7 tenders

Find the latest Die Bonder tenders from different organizations. SigmaTenders helps you participate in these online e-Procurement tenders. We provide access to tender details, BOQs, and technical bids, along with bidding support for Die Bonder e-tenders. Stay informed with daily email alerts and comprehensive coverage across government websites, GeM, and e-Procurement portals.

Die bonder and wedge and ball bonder

Die bonder and wedge and ball bonder

Organisation: Indian Institute of Technology (IIT) | Department of Higher Education
Start Date: September 29, 2026 23:55
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Due Date: 2 days left

Semi-automatic wire bonder with die attach and accessories and the detailed technical specifications

Semi-automatic wire bonder with die attach and accessories and the detailed technical specifications

Organisation: Directorate of Purchase and Stores | Department of Atomic Energy
Start Date: October 01, 2026 23:07
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Due Date: 10 days left
Contract Awarded

Die bonder

๐Ÿ”ง Procurement Notice: Die Bonder Equipment ๐Ÿค– The Department of Higher Education, Ministry of Education, is seeking bids for the procurement of Die Bonder equipment. ๐Ÿ› ๏ธ Submission deadline: July 26, 2024, 12:00 PM Interested bidders should provide detailed technical specifications, pricing, and delivery schedules for this specialized equipment. Keywords: Die Bonder, Equipment, Procurement, Ministry of Education, Department of Higher Education

Organisation: Department of Higher Education | Ministry of Education
Start Date: June 26, 2024 16:57
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Due Date: Expired 815 days ago

Die bonder

Die bonder

Tender EMD: 5.36 Lakh
Tender Fee: 0
Organisation: Department of Defence Research and Development | Central Govt. Ministry/Department
Start Date: March 02, 2024 20:30
Place: Sspl, delhi
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Due Date: Expired 930 days ago

Die bonder

Die bonder

Tender EMD: 5.36 Lakh
Tender Fee: 0
Organisation: Defence eProcurement Portal
Start Date: November 03, 2023 23:30
Place: Sspl (online)
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Due Date: Expired 1055 days ago

Automatic die bonder

Automatic die bonder

Tender EMD: 5 Lakh
Tender Fee: 0
Organisation: Central Public Procurement Portal 1
Start Date: October 16, 2023 23:05
Place: Scl s.a.s. nagar mohali, punjab
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Due Date: Expired 1064 days ago

Procurement of die bonder and pickup tools

Procurement of die bonder and pickup tools. for more details visit our website www.eproc.isro.gov.in

๐Ÿš€ ISRO Procurement Opportunity: Die Bonder & Pickup Tools ๐Ÿš€ The Indian Space Research Organisation (ISRO), a premier Central Government Ministry/Department, invites bids for the procurement of Die bonder and pickup tools. ๐Ÿ› ๏ธ ๐Ÿ“… Bid Submission Deadline: July 22, 2024, 4:00 PM Interested bidders are requested to visit the e-procurement portal of ISRO at www.eproc.isro.gov.in for detailed specifications, bidding documents, and submission guidelines. Keywords: ISRO, Die Bonder, Pickup Tools, Procurement, Electronic Bidding, Space Research, Government of India

Tender EMD: 0
Tender Fee: 0
Organisation: Indian Space Research Organisation | Central Govt. Ministry/Department
Start Date: June 26, 2024 20:45
Place: Ursc bengaluru
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Due Date: Expired 818 days ago

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