Tender Details

Particulars Details
Title
Die Bonder
Description
Die Bonder
Organisation Department of Defence Research and Development | Central Govt. Ministry/Department
Tender Id 2024_DRDO_644773_1
Reference
Number
SPL/MMG/GBM/SPL161/C/23-24/073
Tender Fee 0
EMD 5.36 Lakh
Tender Value -
Place SSPL, DELHI
Link
View Original Tender Notice

https://defproc.gov.in/nicgep/app?page=FrontEndTenderDetailsExternal&service=page&tnid=721849

Start Date March 02, 2024 20:30
End Date
Expired 01/04/2024

Expired 931 days ago

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