Tender Details
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| Particulars | Details |
|---|---|
| Title |
Fabrication Of Dicing Frame Carrier For 8” Dia Wafer As Per Drawing No. Scl/Vahd/Dwg. /2023/10
|
| Description |
|
| Organisation | Department of Electronics and Information Technology | Ministry of Electronics and Information Technology |
| Tender Id | GEM/2023/B/4308033 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://bidplus.gem.gov.in/all-bids |
| Start Date | December 07, 2023 20:45 |
| End Date |
Expired
10/01/2024
Expired 967 days ago |
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Award of Contract & Bid Results
PARAS ENGINEERS
172280
Technical Evaluation Results
| S.No. | Seller Name | Offered Item | Participated On | MSE/MII Status | Status |
|---|---|---|---|---|---|
| 1 | PARAS ENGINEERS | Make : PARAS ENGINEERS Model : 8" WAFER CARRIER Title : DICING FRAME CARRIER | 09-01-2024 13:43:20 | MII MSE | Qualified |
Financial Evaluation Results
| S.No. | Seller Name | Offered Item | Total Price | Rank |
|---|---|---|---|---|
| 1 | PARAS ENGINEERS(MSE)( MSE Social Category:OBC ) | Item Categories : Fabrication of dicing frame carrier for 8” dia wafer as per drawing no. SCL/VAHD/DWG. /2023/10 | 172280.00 | L1 |
Ordered Items & Contract Pricing
| Product | Brand | Model | Ordered Quantity | Price |
|---|---|---|---|---|
| DICING FRAME CARRIER | PARAS ENGINEERS | 8" WAFER CARRIER | 10 | ₹ 172280.000 |
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