Closed 10 Jan 2024

Fabrication of dicing frame carrier for 8” dia wafer as per drawing no. SCL/VAHD/DWG. /2023/10

Department of Electronics and Information Technology | Ministry of Electronics and Information Technology

Original notice

This tender closed on 10 Jan 2024. 2 tenders like it are open now.

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Tender details

Tender ID
GEM/2023/B/4308033
Reference number
–
Organisation
Department of Electronics and Information Technology | Ministry of Electronics and Information Technology
Location
–
Bids open
7 Dec 2023, 3:15 PM
Bids close
10 Jan 2024, 3:00 PM
Tender value
–
EMD
–
Tender fee
–

Source: https://bidplus.gem.gov.in/all-bids

Award of Contract & Bid Results

Awarded Contractor / Winner

PARAS ENGINEERS

Contract Value

172280

Tender Status: active
Buyer Name: Anil Budhwar
Ministry: Ministry Of Electronics And Information Technology
Department: Department Of Electronics And Information Technology
Organisation: Semiconductor Laboratory

Technical Evaluation Results

S.No. Seller Name Offered Item Participated On MSE/MII Status Status
1 PARAS ENGINEERS Make : PARAS ENGINEERS Model : 8" WAFER CARRIER Title : DICING FRAME CARRIER 09-01-2024 13:43:20 MII MSE Qualified

Financial Evaluation Results

S.No. Seller Name Offered Item Total Price Rank
1 PARAS ENGINEERS(MSE)( MSE Social Category:OBC ) Item Categories : Fabrication of dicing frame carrier for 8” dia wafer as per drawing no. SCL/VAHD/DWG. /2023/10 172280.00 L1

Ordered Items & Contract Pricing

Product Brand Model Ordered Quantity Price
DICING FRAME CARRIER PARAS ENGINEERS 8" WAFER CARRIER 10 ₹ 172280.000

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