Tender Details

Particulars Details
Title
Fabrication Of Dicing Frame Carrier For 8” Dia Wafer As Per Drawing No. Scl/Vahd/Dwg. /2023/10
Description
Organisation Department of Electronics and Information Technology | Ministry of Electronics and Information Technology
Tender Id GEM/2023/B/4308033
Reference
Number
Tender Fee
EMD
Tender Value
Place
Link
View Original Tender Notice

https://bidplus.gem.gov.in/all-bids
Start Date December 07, 2023 20:45
End Date
Expired 10/01/2024

Expired 910 days ago

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Tender Result
Tender Status: Active
Additional Information:
Buyer Details
Name: Anil Budhwar
Address: Anil Budhwar,[email protected],SECTOR 72, S.A.S NAGAR, MOHALI, PUNJAB,RUPNAGAR,PUNJAB,160071,India,0172-2296172-
Ministry: Ministry Of Electronics And Information Technology
Department: Department Of Electronics And Information Technology
Organisation: Semiconductor Laboratory
Office Address: 160071
Technical Evaluation
S.No. Seller Name Offered Item Participated On MSE/MII Status Status
1 PARAS ENGINEERS Make : PARAS ENGINEERS Model : 8" WAFER CARRIER Title : DICING FRAME CARRIER 09-01-2024 13:43:20 MII MSE Qualified
Financial Evaluation
S.No. Seller Name Offered Item Total Price Rank
1 PARAS ENGINEERS(MSE)( MSE Social Category:OBC ) Item Categories : Fabrication of dicing frame carrier for 8” dia wafer as per drawing no. SCL/VAHD/DWG. /2023/10 172280.00 L1

Contract Details

Contract Status:
Order Accepted
Seller:
PARAS ENGINEERS
Buyer Designation:
SENIOR PURCHASE AND STORES OFFICER
Buying Mode:
Bid/RA
Contract Date:
2024-02-15 22:24:00 +0530
Contract Amount:
172280
Product Brand Model Ordered Quantity Price
DICING FRAME CARRIER PARAS ENGINEERS 8" WAFER CARRIER 10 ₹ 172280.000
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