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About Tender
🚀 Invitation For Ku Band Beamforming Packaged Chip Bid 🚀 The Indian Space Research Organisation (Isro), A Premier Central Government Ministry/Department, Is Seeking Bids For The Supply Of Ku Band Beamforming Packaged Chips. 🛰️ 📅 Bid Submission Deadline: April 26, 2024, 10:15 Am This Opportunity Is Exclusively For Suppliers Capable Of Delivering High Precision, Advanced Semiconductor Components. Interested Parties Must Submit Detailed Technical And Commercial Proposals Before The Specified Deadline. Keywords: Ku Band Beamforming Packaged Chip, Isro, Semiconductor, Space Technology, Government Tender, Bid Submission, Advanced Components| Particulars | Details |
|---|---|
| Title |
Ku Band Beamforming Packaged Chip
|
| Description |
Ku Band Beamforming Packaged Chip
|
| Organisation | Indian Space Research Organisation | Central Govt. Ministry/Department |
| Tender Id | 2024_ISRO_752093_1 |
|
Reference Number |
SAC/CPUR/SA202200211701 |
| Tender Fee | 0 |
| EMD | 0 |
| Tender Value | - |
| Place | SAC, AHMEDABAD |
| Link |
View Original Tender Notice
https://eprocure.gov.in/epublish/app?page=FrontEndTenderDetailsExternal&service=page&tnid=1055377 |
| Start Date | April 01, 2024 20:30 |
| End Date |
Expired
26/04/2024
Expired 883 days ago |
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