Tender Details

About Tender

🚧 Invitation For Bids: Sewerage Connection Laying Project 🚧 The Information Technology Electronics And Communication Department, Telangana, Invites Bids For The Laying Of A 300mm Diameter Swg Sewerage Line To Provide Connections To M. Sugandha Bai, Represented By Gpa Holder Orange Properties, For Plots Located In Sy.No. 32/B, 33/B, 33/D, And 44, Lingojiguda, Saroor Nagar, Under The Lingojiguda Section, Sub Division I Of O And M Division X A. 📅 Bid Submission Deadline: May 07, 2024, 5:00 Pm Tender Fee: Inr 81 Emd: Inr 2261 Interested Contractors Must Submit Detailed Bids, Including Technical Capabilities, Experience, And Financial Bids, In Accordance With The Project Specifications And Tender Documents. Keywords: Sewerage Connection, Laying Project, It & Electronics Department, Telangana, Government Tender, Swg Line, Bid Submission, Emd, Tender Fee
Particulars Details
Title
Laying Of 300mm Dia Sewerage Connection
Description
Laying Of 300mm Dia Swg Line For Providing Sewer Connection To M. Sugandha Bai Rep By Gpa Holder Orange Properties Sy.No. 32/B, 33/B, 33/D And 44, Lingojiguda, Saroor Nagar Under Lingojiguda Section, Sub Div I Of O And M Div.X A Vide File No. 2023 12 63
Organisation Information Technology Electronics and Communication Department Telangana | State Govt. and UT
Tender Id 513330
Reference
Number
EP-13/CGM(E)/RC/2024-25, Dt:30.04.2024
Tender Fee 81
EMD 2261
Tender Value -
Place TS
Link
View Original Tender Notice

http://eprocurement.telangana.gov.in/

Start Date April 30, 2024 23:00
End Date
Expired 07/05/2024

Expired 893 days ago

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