Fabrication And Supply Of Conventional Mlb And High Density Interconnect (Hdi) Printed Circuit Boards (Pc Bs) 18 To 32 Layers

Particulars	Details
Title	Fabrication And Supply Of Conventional Mlb And High Density Interconnect (Hdi) Printed Circuit Boards (Pc Bs) 18 To 32 Layers
Description	Fabrication And Supply Of Conventional Mlb&#X0d And High Density Interconnect (Hdi) Printed Circuit&#X0d Boards (Pc Bs) 18 To 32 Layers
Organisation	Indian Space Research Organisation \| Central Govt. Ministry/Department
Tender Id	2025_ISRO_803201_1
Reference Number	SAC/CPUR/SA202500113501
Tender Fee	0
EMD	0
Tender Value	-
Place	SAC, AHMEDABAD
Link	View Original Tender Notice https://eprocure.gov.in/epublish/app?page=FrontEndTenderDetailsExternal&service=page&tnid=1107873
Start Date	June 26, 2025 22:00
End Date	Expired 31/07/2025 Expired 387 days ago Search Similar tenders?

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