Tender Details
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About Tender
🔧 Procurement Opportunity: Wire Bonder Equipment 🛠️ The Department Of Higher Education, Ministry Of Education, Is Seeking Bids For The Procurement Of Wire Bonder Equipment. 🤖 📅 Bid Submission Deadline: July 25, 2024, 7:30 Pm Suppliers With Cutting Edge Technology And Reliable Service Records Are Invited To Submit Detailed Bids, Including Technical Specifications, Pricing, And Delivery Schedules. Keywords: Wire Bonder, Equipment, Procurement, Department Of Higher Education, Ministry Of Education, Government Tender| Particulars | Details |
|---|---|
| Title |
Wire Bonder
|
| Description |
|
| Organisation | Department of Higher Education | Ministry of Education |
| Tender Id | GEM/2024/B/5091264 |
|
Reference Number |
|
| Tender Fee | |
| EMD | |
| Tender Value | |
| Place | |
| Link | https://bidplus.gem.gov.in/all-bids |
| Start Date | June 25, 2024 23:58 |
| End Date |
25/07/2024 ( Expired 337 days ago ) Search Similar tenders? |
|
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Tender Result
Tender Status:
Active
Additional Information:
Average Turn Over of Last 3 Years: 23 Lakhs
Experience with Gov. Required: Years
Buyer Details
Name:
Hussain Jeevakhan
Address:
Hussain Jeevakhan,[email protected],N.I.T.T.T.R., Shanti Marg, Shamla Hills Bhopal,BHOPAL,MADHYA PRADESH,462002,India,0755-2661600-360
Ministry:
Ministry Of Education
Department:
Department Of Higher Education
Organisation:
National Institute Of Technical Teachers Training And Research (nitttrs)
Office Address:
Bhopal
Technical Evaluation
| S.No. | Seller Name | Offered Item | Participated On | EMD Status | MSE/MII Status | Status |
|---|---|---|---|---|---|---|
| 1 | Bergen Electronics Ltd | Make : JFPM Model : JFPM100E Title : WIREBONDER | 25-07-2024 11:53:23 | Registered with designated Agency / Authority | MII N/A | Qualified |
| 2 | ELCAMINO TECHNOLOGIES PRIVATE LIMITED | Make : Hybond Model : Model 676 Title : Manual wire Bonder(wedge bonder) | 25-07-2024 12:17:48 | Offline upload | N/A | Disqualified |
| 3 | ESS TECHNOSYS PRIVATE LIMITED | Make : WEST BOND INC Model : 7476D Title : WIRE NONDER | 25-07-2024 09:35:01 | Registered with designated Agency / Authority | MII N/A | Qualified |
| 4 | MCUBE TECHNOLOGIES PRIVATE LIMITED | Make : TPT Wire Bonder GmbH & Co. KG Model : HB02 Title : Manual Wedge Wire Bonder | 12-07-2024 12:15:19 | Registered with designated Agency / Authority | MII N/A | Qualified |
Financial Evaluation
| S.No. | Seller Name | Offered Item | Total Price | Rank |
|---|---|---|---|---|
| 1 | MCUBE TECHNOLOGIES PRIVATE LIMITED | Item Categories : Wire Bonder | 3687264.00 | L1 |
| 2 | Bergen Electronics Ltd | Item Categories : Wire Bonder | 6291553.03 | L2 |
| 3 | ESS TECHNOSYS PRIVATE LIMITED | Item Categories : Wire Bonder | 6796440.00 | L3 |
Contract Details
- Contract Status:
- Waiting for Seller Payment
- Seller:
- MCUBE TECHNOLOGIES PRIVATE LIMITED
- Buyer Designation:
- ASSISTANT PROFESSOR AND PIS
- Buying Mode:
- Bid/RA
- Contract Date:
- 2024-11-07 22:13:00 +0530
- Contract Amount:
- 3292200
| Product | Brand | Model | Ordered Quantity | Price |
|---|---|---|---|---|
| Manual Wedge Wire Bonder | TPT Wire Bonder GmbH & Co. KG | HB02 | 1 | ₹ 3292200.000 |
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