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| Particulars | Details |
|---|---|
| Title |
Backend Design,Physical Ip,Fabrication,Packaging And Supply Of Multi Processor System On Chips
|
| Description |
Backend Design,Physical Ip,Fabrication,Packaging And Supply Of Multi Processor System On Chips
|
| Organisation | Department of Defence Research and Development | Central Govt. Ministry/Department |
| Tender Id | 2025_DRDO_700325_1 |
|
Reference Number |
RCI/25ATT144/CMS-II |
| Tender Fee | 100 |
| EMD | 2.14 Crore |
| Tender Value | - |
| Place | CONFERENCE HALL,DCMM,RCI |
| Link |
View Original Tender Notice
https://defproc.gov.in/nicgep/app?page=FrontEndTenderDetailsExternal&service=page&tnid=784316 |
| Start Date | March 05, 2025 23:30 |
| End Date |
Expired
07/04/2025
Expired 552 days ago |
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