Tender Details

Particulars Details
Title
Backend Design,Physical Ip,Fabrication,Packaging And Supply Of Multi Processor System On Chips
Description
Backend Design,Physical Ip,Fabrication,Packaging And Supply Of Multi Processor System On Chips
Organisation Department of Defence Research and Development | Central Govt. Ministry/Department
Tender Id 2025_DRDO_700325_1
Reference
Number
RCI/25ATT144/CMS-II
Tender Fee 100
EMD 2.14 Crore
Tender Value
Place CONFERENCE HALL,DCMM,RCI
Link
View Original Tender Notice

https://defproc.gov.in/nicgep/app?page=FrontEndTenderDetailsExternal&service=page&tnid=784316

Start Date March 05, 2025 23:30
End Date
Expired 07/04/2025

Expired 441 days ago

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