Tender Details

Particulars Details
Title
Wafer Bumping Service
Description
Wafer Bumping Service
Organisation Semi-Conductor Laboratory (SCL) | Central Govt. Ministry/Department
Tender Id 2024_SCL_794863_1
Reference
Number
SCL/PS/44989/APD/05/2024
Tender Fee 0
EMD 0
Tender Value
Place Semi Conductor Laboratory
Link
View Original Tender Notice

https://eprocure.gov.in/eprocure/app?page=FrontEndTenderDetailsExternal&service=page&tnid=835830

Start Date February 13, 2024 19:30
End Date
Expired 04/03/2024

Expired 850 days ago

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