Custom Bid For Services Lbga324 Packaged Chip And Test Board,Custom Bid For Services Glob Top Pa

Particulars	Details
Title	Custom Bid For Services Lbga324 Packaged Chip And Test Board,Custom Bid For Services Glob Top Pa
Description
Organisation	Department of Electronics and Information Technology \| Ministry of Electronics and Information Technology
Tender Id	GEM/2023/B/4367666
Reference Number	-
Tender Fee	-
EMD	-
Tender Value	-
Place
Link	View Original Tender Notice https://gem.gov.in/
Start Date	December 19, 2023 23:02
End Date	Expired 08/01/2024 Expired 1016 days ago Search Similar tenders?

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Awarded Contractor / Winner

CRAFTRONICS INDIA PRIVATE LIMITEDTESSOLVE SEMICONDUCTOR PRIVATE LIMITED

Tender Status: active

Additional Information: Average Turn Over of Last 3 Years: Lakhs Experience with Gov. Required: Years Project Experience Required: No

Buyer Name: Dhanya

Ministry: Ministry Of Electronics And Information Technology

Department: Department Of Electronics And Information Technology

Organisation: Centre For Development Of Advanced Computing (c-dac)

S.No.	Seller Name	Participated On	MSE/MII Status	Status
1	BERYLLINE LABS PRIVATE LIMITED	29-12-2023 17:55:53	MSE	Evaluated
2	CRAFTRONICS INDIA PRIVATE LIMITED	26-12-2023 19:32:09	MSE	Evaluated
3	TESSOLVE SEMICONDUCTOR PRIVATE LIMITED	05-01-2024 22:54:18	N/A	Evaluated

Service	Category Name	Ordered Quantity	Price
Custom Bid for Services - LBGA324 Packaged Chip and Test Board	Custom Bid for Services	1	₹ 4350000.000
Custom Bid for Services - GlobTop Packaged Chip and Test Board	Custom Bid for Services	1	₹ 2590100.000

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