Tender Details

Particulars Details
Title
Custom Bid For Services Lbga324 Packaged Chip And Test Board,Custom Bid For Services Glob Top Pa
Description
Organisation Department of Electronics and Information Technology | Ministry of Electronics and Information Technology
Tender Id GEM/2023/B/4367666
Reference
Number
Tender Fee
EMD
Tender Value
Place
Link
View Original Tender Notice

https://gem.gov.in/

Start Date December 19, 2023 23:02
End Date
Expired 08/01/2024

Expired 914 days ago

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Tender Result
Tender Status: Active
Additional Information: Average Turn Over of Last 3 Years: Lakhs Experience with Gov. Required: Years Project Experience Required: No
Buyer Details
Name: Dhanya
Address: Dhanya,[email protected],Purchase Department, Centre for Development of Advanced Computing, Vellayambalam,THIRUVANANTHAPURAM,KERALA,695033,India,0471-2723333-258
Ministry: Ministry Of Electronics And Information Technology
Department: Department Of Electronics And Information Technology
Organisation: Centre For Development Of Advanced Computing (c-dac)
Office Address: Thiruvananthapuram
Technical Evaluation
S.No. Seller Name Participated On MSE/MII Status Status
1 BERYLLINE LABS PRIVATE LIMITED 29-12-2023 17:55:53 MSE Evaluated
2 CRAFTRONICS INDIA PRIVATE LIMITED 26-12-2023 19:32:09 MSE Evaluated
3 TESSOLVE SEMICONDUCTOR PRIVATE LIMITED 05-01-2024 22:54:18 N/A Evaluated

Contract Details

Contract Status:
Order Accepted Order Accepted
Seller:
CRAFTRONICS INDIA PRIVATE LIMITEDTESSOLVE SEMICONDUCTOR PRIVATE LIMITED
Buyer Designation:
PHS ASSISTANT1PHS ASSISTANT1
Buying Mode:
Bid/RABid/RA
Contract Date:
2024-02-05 23:22:00 +0530
Contract Amount:
Service Category Name Ordered Quantity Price
Custom Bid for Services - LBGA324 Packaged Chip and Test Board Custom Bid for Services 1 ₹ 4350000.000
Service Category Name Ordered Quantity Price
Custom Bid for Services - GlobTop Packaged Chip and Test Board Custom Bid for Services 1 ₹ 2590100.000
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