Wafer Dicing Equipment
Department of Higher Education | Ministry of Education
This tender closed on 16 Jan 2025. 6 tenders like it are open now.
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For complete description and other details, please refer to tender document.
Ministry of Railways Closes 13 Nov 2026
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Dicing Blade Z09-SD3000-Y1-6072XO 035ASX40-V
Semi-Conductor Laboratory (SCL) · Punjab Closes 17 Nov 2026
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Supply of Primary Flow Wrap for 1 Kg Mozzarella Cheese Diced/Blend and 1 Kg Cheddar cheese Dice to Kanakapura Dairy for a period of one year Co-Packing for Mother Dairy
Karnataka Co-operative Milk Producers Federation Limited · Karnataka Closes 12 Nov 2026
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50NB Butterfly Valve, Wafer type with both end flanges, Hand lever operated type,80NB Butterfly Valve, Wafer type with both end flanges, Hand lever operated type,100NB Butterfly Valve, Wafer type with both end flanges, Hand lever operated type,150NB
Directorate of Purchase and Stores | Department of Atomic Energy · Tamil Nadu Closes 16 Nov 2026
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Tender details
- Tender ID
- GEM/2024/B/5753868
- Reference number
- –
- Organisation
- Department of Higher Education | Ministry of Education
- Location
- –
- Bids open
- 26 Dec 2024, 5:20 PM
- Bids close
- 16 Jan 2025, 6:00 PM
- Tender value
- –
- EMD
- –
- Tender fee
- –
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Customized AMC/CMC for Pre-owned Products - AMC for wafer dicing system; Advance Dicing Technologie
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