Tender Details
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| Particulars | Details |
|---|---|
| Title |
Anc Pcb Thermal Analysis
|
| Description |
|
| Organisation | Department of Defence Research & Development | Ministry of Defence |
| Tender Id | GEM/2024/B/5321113 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://bidplus.gem.gov.in/all-bids |
| Start Date | August 23, 2024 20:34 |
| End Date |
Expired
14/09/2024
Expired 759 days ago |
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Award of Contract & Bid Results
Technical Evaluation Results
| S.No. | Seller Name | Offered Item | Participated On | MSE/MII Status | Status |
|---|---|---|---|---|---|
| 1 | BENDRA AEROSPACE PRIVATE LIMITED | Make : OBCF Model : OBCF BOARD Title : PCB Layout, Fabrication, assembly, PI & Thermal analysis of cPCI bus based Analog Output Card | 30-08-2024 16:10:05 | MSE | Qualified |
| 2 | CircuitWorks Engineering | Make : NA Model : Thermal analysis Title : ANC PCB thermal analysis | 09-09-2024 13:31:25 | N/A | Qualified |
| 3 | oscitrox | Make : Rehob Technologies Model : Thermal analysis Title : ANC PCB thermal analysis | 09-09-2024 20:36:15 | N/A | Qualified |
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