Tender Details

Particulars Details
Title
Component Assembly On Multi Layer Printed Circuit Boards
Description
Organisation Department of Atomic Energy | PMO
Tender Id GEM/2024/B/5181530
Reference
Number
-
Tender Fee -
EMD -
Tender Value -
Place
Link
View Original Tender Notice

https://bidplus.gem.gov.in/all-bids

Start Date July 22, 2024 21:47
End Date
Expired 12/08/2024

Expired 793 days ago

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Award of Contract & Bid Results

Tender Status: active
Buyer Name: Bhagwan Sahai Jatav
Ministry: Pmo
Department: Department Of Atomic Energy
Organisation: Directorate Of Purchase And Stores

Technical Evaluation Results

S.No. Seller Name Offered Item Participated On MSE/MII Status Status
1 BERYLLINE LABS PRIVATE LIMITED Make : BERYLLINE Model : custom built Title : custom built 12-08-2024 13:54:20 MSE Disqualified
2 Bharat Enterprises Make : As per attached Model : Multiple As per Attached Title : Component assembly on multi-layer Printed Circuit Boards 12-08-2024 13:41:45 N/A Disqualified
3 S M ELECTRONICS AND ENGINEERING CO Make : NA Model : Component assembly on multi-layer Printed Circuit Title : Component assembly on multi-layer Printed Circuit Boards 07-08-2024 17:44:34 N/A Qualified
4 TECH NID SOLUTIONS Make : TECHNID SOLUTIONS Model : CUSTOM Title : CUSTOM 12-08-2024 13:38:13 MSE Qualified

Financial Evaluation Results

S.No. Seller Name Offered Item Total Price Rank
1 S M ELECTRONICS AND ENGINEERING CO Item Categories : Component assembly on multi-layer Printed Circuit Boards 448750.00 L1
2 TECH NID SOLUTIONS (MSE)( MSE Social Category:General ) Item Categories : Component assembly on multi-layer Printed Circuit Boards 609725.00 L2
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