EOI -Enabling Packaging, Multi-Project Wafer (MPW) Prototyping and Post Silicon Validation Services For ChipIN Centre
Department of Electronics and Information Technology(DeitY) | Central Govt. Ministry/Department · Bangalore
- EMD
- ₹0
- Tender fee
- ₹0
This tender closed on 07 Nov 2024.
Tender details
EOI-Enabling Packaging, Multi-Project Wafer (MPW)
 Prototyping Post Silicon Validation Services
 For ChipIN Centre
- Tender ID
- 2024_DIT_831068_1
- Reference number
- C-DACB/EOI- PKG-MPW-PSV/2024-25
- Organisation
- Department of Electronics and Information Technology(DeitY) | Central Govt. Ministry/Department
- Location
- Bangalore
- Bids open
- 18 Oct 2024, 2:15 PM
- Bids close
- 7 Nov 2024, 6:00 PM
- Tender value
- –
- EMD
- ₹0
- Tender fee
- ₹0
Source: https://eprocure.gov.in/eprocure/app?page=FrontEndTenderDetailsExternal&service=page&tn...
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