Eoi Enabling Packaging, Multi Project Wafer (Mpw) Prototyping And Post Silicon Validation Services For Chip In Centre

Particulars	Details
Title	Eoi Enabling Packaging, Multi Project Wafer (Mpw) Prototyping And Post Silicon Validation Services For Chip In Centre
Description	Eoi Enabling Packaging, Multi Project Wafer (Mpw)&#X0d Prototyping Post Silicon Validation Services&#X0d For Chip In Centre
Organisation	Department of Electronics and Information Technology(DeitY) \| Central Govt. Ministry/Department
Tender Id	2024_DIT_831068_1
Reference Number	C-DACB/EOI- PKG-MPW-PSV/2024-25
Tender Fee	0
EMD	0
Tender Value	-
Place	Bangalore
Link	View Original Tender Notice https://eprocure.gov.in/eprocure/app?page=FrontEndTenderDetailsExternal&service=page&tnid=873470
Start Date	October 18, 2024 19:45
End Date	Expired 07/11/2024 Expired 710 days ago Search Similar tenders?

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