Tender Details
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| Particulars | Details |
|---|---|
| Title |
Fabrication Of Cpu Module Pcb
|
| Description |
|
| Organisation | Department of Defence Production | Ministry of Defence |
| Tender Id | GEM/2023/B/3313925 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://gem.gov.in/ |
| Start Date | March 29, 2023 15:57 |
| End Date |
Expired
05/07/2023
Expired 1199 days ago |
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Award of Contract & Bid Results
Technical Evaluation Results
| S.No. | Seller Name | Offered Item | Participated On | MSE/MII Status | Status |
|---|---|---|---|---|---|
| 1 | MICROPACK PRIVATE LIMITED | Make : NA Model : Fabrication Of CPU Module PCB ( Q3 ) Title : Fabrication Of CPU Module PCB ( Q3) | 08-08-2023 08:52:00 | N/A | Qualified |
Financial Evaluation Results
| S.No. | Seller Name | Offered Item | Total Price | Rank |
|---|---|---|---|---|
| 1 | MICROPACK PRIVATE LIMITED | Item Categories : Fabrication of CPU Module PCB | 404995.00 | L1 |
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