Tender Details

This tender closed on 05 Jul 2023. 10 tenders like it are open now.

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Title
Fabrication Of Cpu Module Pcb
Description
Organisation Department of Defence Production | Ministry of Defence
Tender Id GEM/2023/B/3313925
Reference
Number 		-
Tender Fee -
EMD -
Tender Value -
Place
Link
View Original Tender Notice

https://gem.gov.in/
Start Date March 29, 2023 15:57
End Date
Expired 05/07/2023

Expired 1222 days ago

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Award of Contract & Bid Results

Tender Status: active
Ministry: Ministry Of Defence
Department: Department Of Defence Production
Organisation: Hindustan Aeronautics Limited (hal)

Technical Evaluation Results

S.No. Seller Name Offered Item Participated On MSE/MII Status Status
1 MICROPACK PRIVATE LIMITED Make : NA Model : Fabrication Of CPU Module PCB ( Q3 ) Title : Fabrication Of CPU Module PCB ( Q3) 08-08-2023 08:52:00 N/A Qualified

Financial Evaluation Results

S.No. Seller Name Offered Item Total Price Rank
1 MICROPACK PRIVATE LIMITED Item Categories : Fabrication of CPU Module PCB 404995.00 L1

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