Tender Details
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| Particulars | Details |
|---|---|
| Title |
Screen Flex Bonding,Lvds,Fl Inverter,Ic Smd,Diode,Mother Board Smsc,Main Chip
|
| Description |
|
| Organisation | Department of Military Affairs | Ministry of Defence |
| Tender Id | GEM/2024/B/4628367 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://bidplus.gem.gov.in/all-bids |
| Start Date | February 13, 2024 23:25 |
| End Date |
Expired
23/02/2024
Expired 965 days ago |
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Award of Contract & Bid Results
Technical Evaluation Results
| S.No. | Seller Name | Offered Item | Participated On | MSE/MII Status | Status |
|---|---|---|---|---|---|
| 1 | B S INDIA | - | 23-02-2024 09:30:32 | MII | Qualified |
| 2 | Bharti Dent India | - | 23-02-2024 10:09:36 | MII | Disqualified |
| 3 | ORAMCO INTERNATIONAL | - | 23-02-2024 10:04:46 | MII MSE | Qualified |
| 4 | Sunstar Exim | - | 23-02-2024 09:15:17 | MII MSE | Qualified |
Financial Evaluation Results
| S.No. | Seller Name | Offered Item | Total Price | Rank |
|---|---|---|---|---|
| 1 | Sunstar Exim(MSE,MII)( MSE Social Category:General ) | Item Categories : SCREEN FLEX BONDING,LVDS,FL INVERTER,IC SMD,DIODE,MOTHER BOARD SMSC,MAIN CHIP | 82431.78 | L1 |
| 2 | B S INDIA (MII) | Item Categories : SCREEN FLEX BONDING,LVDS,FL INVERTER,IC SMD,DIODE,MOTHER BOARD SMSC,MAIN CHIP | 84136.52 | L2 |
| 3 | ORAMCO INTERNATIONAL (MSE,MII)( MSE Social Category:General ) | Item Categories : SCREEN FLEX BONDING,LVDS,FL INVERTER,IC SMD,DIODE,MOTHER BOARD SMSC,MAIN CHIP | 90700.00 | L3 |
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