Tender Details
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| Particulars | Details |
|---|---|
| Title |
Mcu Card Evm Iss 1, 4 Layer Board Pcb
|
| Description |
|
| Organisation | Department of Telecommunications (DOT) | Ministry of Communications |
| Tender Id | GEM/2024/B/5470996 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://bidplus.gem.gov.in/all-bids |
| Start Date | October 04, 2024 22:05 |
| End Date |
Expired
14/10/2024
Expired 733 days ago |
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Award of Contract & Bid Results
MICROPACK PRIVATE LIMITED
256065.9
Technical Evaluation Results
| S.No. | Seller Name | Offered Item | Participated On | MSE/MII Status | Status |
|---|---|---|---|---|---|
| 1 | ARGUS EMBEDDED SYSTEMS PRIVATE LIMITED | Make : Argus Embedded Systems Pvt Ltd. Model : MCU CARD EVM-ISS-1, 4 LAYER BOARD PCB Title : MCU CARD EVM-ISS-1, 4 LAYER BOARD PCB | 09-10-2024 18:19:24 | MSE | Qualified |
| 2 | MICROPACK PRIVATE LIMITED | Make : NA Model : MCU CARD EVM-ISS-1 Title : MCU CARD EVM-ISS-1, 4 LAYER BOARD PCB | 14-10-2024 11:59:50 | MSE | Qualified |
Financial Evaluation Results
| S.No. | Seller Name | Offered Item | Total Price | Rank |
|---|---|---|---|---|
| 1 | MICROPACK PRIVATE LIMITED(MSE)( MSE Social Category:General ) | Item Categories : MCU CARD EVM-ISS-1, 4 LAYER BOARD PCB | 217005.00 | L1 |
| 2 | ARGUS EMBEDDED SYSTEMS PRIVATE LIMITED (MSE)( MSE Social Category:General ) | Item Categories : MCU CARD EVM-ISS-1, 4 LAYER BOARD PCB | 268620.00 | L2 |
Ordered Items & Contract Pricing
| Product | Brand | Model | Ordered Quantity | Price |
|---|---|---|---|---|
| MCU CARD EVM-ISS-1, 4 LAYER BOARD PCB | NA | MCU CARD EVM-ISS-1 | 1110 | ₹ 256065.900 |
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