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| Particulars | Details |
|---|---|
| Title |
Repair Of Plc Automation Module And Hmi Of Wafer Surface Grinder System
|
| Description |
Repair Of Plc Automation Module And Hmi Of Wafer Surface Grinder System
|
| Organisation | Department of Defence Research and Development | Central Govt. Ministry/Department |
| Tender Id | 2025_DRDO_698887_1 |
|
Reference Number |
SSPL/MMG/SBM/B/R/24-25/084 |
| Tender Fee | 0 |
| EMD | 12461 |
| Tender Value | - |
| Place | SSPL, DELHI |
| Link |
View Original Tender Notice
https://defproc.gov.in/nicgep/app?page=FrontEndTenderDetailsExternal&service=page&tnid=782636 |
| Start Date | February 25, 2025 20:30 |
| End Date |
Expired
17/03/2025
Expired 573 days ago |
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