Closed 23 Apr 2024

Supply of Wire I.G. 8 SWG (4.064 mm dia) for track circuit bonding as per Specification No.IS:279/81 or latest.

Ministry of Railways | Central Govt. Ministry/Department · Kolkata

EMD
₹0
Tender fee
₹0
Original notice

This tender closed on 23 Apr 2024.

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Tender details

For complete deion and other details, please refer to tender

🚂 Procurement Alert: Supply of Wire I.G. 8 SWG 🔗 The Ministry of Railways, under the Central Government, invites tenders for the supply of Wire I.G. 8 SWG (4.064 mm dia) for track circuit bonding, as per Specification No.IS:279/81 or the latest. 📅 Bid Submission Deadline: April 23, 2024, 2:00 PM Tender fee: INR 0 EMD: INR 0 Interested bidders are requested to refer to the tender document for complete details and specifications. Bidders must comply with all the terms and conditions as stipulated in the tender document. Keywords: Wire I.G. 8 SWG, Track Circuit Bonding, Ministry of Railways, Tender, Government Procurement, Specification No.IS:279/81

Tender ID
106307613
Reference number
56233071B
Organisation
Ministry of Railways | Central Govt. Ministry/Department
Location
Kolkata
Bids open
2 Apr 2024, 1:04 PM
Bids close
23 Apr 2024, 2:00 PM
Tender value
–
EMD
₹0
Tender fee
₹0

Source: https://www.ireps.gov.in/ireps/supply/pdfdocs/042024/106307613/viewNitPdf_4526842.pdf

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