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| Particulars | Details |
|---|---|
| Title |
Processing Of Epi Wafer And Fabrication Of 976nm Laser Chips And Packaging
|
| Description |
Processing Of Epi Wafer And Fabrication Of 976nm Laser Chips And Packaging
|
| Organisation | Department of Defence Research and Development | Defence Research and Development Organisation | DFMM | Office of DG (MED and COS) | SSPL |
| Tender Id | Login to view |
|
Reference Number |
Login to view |
| Tender Fee | - |
| EMD | 2.97 Lakh |
| Tender Value | - |
| Place | |
| Link | Login to view |
| Start Date | October 01, 2026 22:40 |
| End Date |
Closing soon
15/10/2026
3 days left |
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