Tender Details
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| Particulars | Details |
|---|---|
| Title |
Custom Bid For Services Wafer Processing At Ce Nse Ii Sc
|
| Description |
|
| Organisation | Department of Electronics and Information Technology | Ministry of Electronics and Information Technology |
| Tender Id | GEM/2025/B/5832195 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://bidplus.gem.gov.in/all-bids |
| Start Date | January 22, 2025 19:39 |
| End Date |
Expired
12/02/2025
Expired 608 days ago |
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Award of Contract & Bid Results
Processing of epi-wafer and fabrication of 976nm laser chips and packaging
Processing of epi-wafer and fabrication of 976nm laser chips and packaging
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Flangeless wafer type butterfly conforming api std. 609 size 100 nb,flangeless wafer type butterfly conforming api std. 609 size 150 nb,flangeless wafer type butterfly conforming api std. 609, size: 300 nb,flangeless wafer type butterfly conforming api std. 609 size 350 nb
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