Aluminum Bonding Wire (1.0 Mil Dia. ),Aluminum Bonding Wire (1.25 Mil Dia)

Particulars	Details
Title	Aluminum Bonding Wire (1.0 Mil Dia. ),Aluminum Bonding Wire (1.25 Mil Dia)
Description
Organisation	Department of Electronics and Information Technology \| Ministry of Electronics and Information Technology
Tender Id	GEM/2025/B/6055164
Reference Number	-
Tender Fee	-
EMD	-
Tender Value	-
Place
Link	View Original Tender Notice https://bidplus.gem.gov.in/all-bids
Start Date	March 13, 2025 22:39
End Date	Expired 03/04/2025 Expired 540 days ago Search Similar tenders?

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Tender Status: active

Buyer Name: Naresh Singh

Ministry: Ministry Of Electronics And Information Technology

Department: Department Of Electronics And Information Technology

Organisation: Semiconductor Laboratory

S.No.	Seller Name	Offered Item	Participated On	MSE/MII Status	Status
1	ELCAMINO TECHNOLOGIES PRIVATE LIMITED	Make : Heraeus Model : 5164278 Title : Aluminum Bonding Wire (1.0 mil dia. )	21-03-2025 16:47:17	MII	Qualified
2	PROLYX MICROELECTRONICS PRIVATE LIMITED	Make : Ametek Engineered Materials Model : Al wire 1 mil Title : Aluminum Bonding Wire (1.0 mil dia. )	03-04-2025 16:39:07	MII	Qualified