Tender Details
This tender closed on 15 Mar 2024.
| Particulars | Details |
|---|---|
| Title |
Breadboard Kit,Soldering Kit,Paper Circuit Lite Kit,Flex Sensor,Raspberry Pi Pico
|
| Description |
|
| Organisation | Education (Elementary and Secondary) Department Rajasthan | |
| Tender Id | GEM/2024/B/4730930 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://bidplus.gem.gov.in/all-bids |
| Start Date | March 04, 2024 19:10 |
| End Date |
Expired
15/03/2024
Expired 968 days ago |
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Award of Contract & Bid Results
CORECHAMP TECHNOLOGIES PRIVATE LIMITED
9157
Technical Evaluation Results
| S.No. | Seller Name | Offered Item | Participated On | MSE/MII Status | Status |
|---|---|---|---|---|---|
| 1 | CORECHAMP TECHNOLOGIES PRIVATE LIMITED | - | 06-03-2024 11:09:13 | MII MSE | Qualified |
| 2 | EGadget Enterprises | - | 06-03-2024 11:27:49 | MII | Qualified |
| 3 | FSTI INDIA | - | 12-03-2024 08:32:53 | N/A | Qualified |
Financial Evaluation Results
| S.No. | Seller Name | Offered Item | Total Price | Rank |
|---|---|---|---|---|
| 1 | CORECHAMP TECHNOLOGIES PRIVATE LIMITED(MSE,MII)( MSE Social Category:General ) | Item Categories : Breadboard Kit,Soldering Kit,Paper Circuit Lite Kit,Flex Sensor,Raspberry Pi Pico | 9157.00 | L1 |
| 2 | EGadget Enterprises (MII) | Item Categories : Breadboard Kit,Soldering Kit,Paper Circuit Lite Kit,Flex Sensor,Raspberry Pi Pico | 11000.00 | L2 |
| 3 | FSTI INDIA | Item Categories : Breadboard Kit,Soldering Kit,Paper Circuit Lite Kit,Flex Sensor,Raspberry Pi Pico | 14499.00 | L3 |
Ordered Items & Contract Pricing
| Product | Brand | Model | Ordered Quantity | Price |
|---|---|---|---|---|
| Breadboard Kit | NA | BOQ Item | 1 | ₹ 999.000 |
| Soldering Kit | NA | BOQ Item | 1 | ₹ 2999.000 |
| Paper Circuit Lite Kit | NA | BOQ Item | 1 | ₹ 999.000 |
| Flex Sensor | NA | BOQ Item | 10 | ₹ 3200.000 |
| Raspberry Pi Pico | NA | BOQ Item | 2 | ₹ 960.000 |
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