Tender Details

Particulars Details
Title
Component Assembly On Multi Layer Printed Circuit Boards
Description
Organisation Department of Atomic Energy | PMO
Tender Id GEM/2023/B/3845715
Reference
Number
-
Tender Fee -
EMD -
Tender Value -
Place
Link
View Original Tender Notice

https://gem.gov.in/

Start Date August 22, 2023 19:50
End Date
Expired 13/09/2023

Expired 1108 days ago

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Award of Contract & Bid Results

Tender Status: active
Buyer Name: Rekha Ramesh Shirsat
Ministry: Pmo
Department: Department Of Atomic Energy
Organisation: Directorate Of Purchase And Stores

Technical Evaluation Results

S.No. Seller Name Offered Item Participated On MSE/MII Status Status
1 ARROW ENGINEERING INDUSTRIES PRIVATE LIMITED Make : NA Model : ARROW6412 Title : Machining Components 13-09-2023 13:15:00 MSE Disqualified
2 BERYLLINE LABS PRIVATE LIMITED Make : BERYLLINE Model : as per bid Title : as per bid 21-09-2023 13:43:20 MSE Qualified
3 JAINSON ELECTRICALS Make : Mefron Technologies India Pvt Ltd Model : As per attached catalog/datasheet Title : Component assembly on Multi-layer Printed Circuit Boards 21-09-2023 13:58:34 N/A Disqualified
4 S M ELECTRONICS AND ENGINEERING CO Make : NA Model : Multi-layer Printed Circuit Boards Title : Multi-layer Printed Circuit Boards 11-09-2023 16:03:45 N/A Qualified
5 TECH NID SOLUTIONS Make : TECHNID SOLUTIONS Model : Component assembly on Multi-layer Printed Circuit Title : Component assembly on Multi-layer Printed Circuit Boards 13-09-2023 13:23:22 MSE Qualified

Financial Evaluation Results

S.No. Seller Name Offered Item Total Price Rank
1 S M ELECTRONICS AND ENGINEERING CO Item Categories : Component assembly on Multi-layer Printed Circuit Boards 450750.00 L1
2 BERYLLINE LABS PRIVATE LIMITED (MSE)( MSE Social Category:General ) Item Categories : Component assembly on Multi-layer Printed Circuit Boards 602500.00 L2
3 TECH NID SOLUTIONS (MSE)( MSE Social Category:General ) Item Categories : Component assembly on Multi-layer Printed Circuit Boards 1111420.00 L3
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