About Tender

🚂 Procurement Opportunity: Polymer Buffer Spring Pad Assembly 🛠️ The Ministry Of Railways, Under The Central Government, Invites Bids For The Supply Of Polymer Buffer Spring Pad Assembly. 🚂 📅 Bid Submission Deadline: July 30, 2024, 10:30 Am Interested Suppliers Must Submit A Tender Security Of Inr 3,11,730/ And Adhere To The Detailed Specifications And Guidelines Outlined In The Tender Document. Keywords: Polymer Buffer Spring Pad Assembly, Ministry Of Railways, Central Government, Procurement, Railways Equipment, Tender, Bid Security