Closed 27 Apr 2024

Cpu pcb - c106.17. 5601, layers - 16, thikness - 2.20 mm, grade - lcso, material - tu 872lk, finish

Department of Defence Production | Ministry of Defence

This tender closed on 27 Apr 2024.

Tender details

πŸ’» Procurement Opportunity: CPU PCB Manufacturing πŸ”§ The Department of Defence Production within the Ministry of Defence is seeking bids for the supply of CPU PCBs (C106.17. 5601) with specific technical specifications. πŸ“‹ πŸ“… Bid Submission Deadline: April 27, 2024, 3:00 PM The PCBs must have 16 layers, a thickness of 2.20 mm, be of LCSO grade, made of TU 872LK material, and have the specified finish. Interested vendors should submit detailed bids that meet the outlined requirements and adhere to the stipulated timelines. Keywords: CPU PCB, C106.17. 5601, Layers, Thickness, Grade, Material, Finish, Defence Production, Ministry of Defence, Procurement Tender

Tender ID
GEM/2024/B/4868654
Reference number
–
Organisation
Department of Defence Production | Ministry of Defence
Location
–
Bids open
17 Apr 2024, 2:19 PM
Bids close
27 Apr 2024, 3:00 PM
Tender value
–
EMD
–
Tender fee
–

Source: https://bidplus.gem.gov.in/all-bids

Award of Contract & Bid Results

Tender Status: active
Ministry: Ministry Of Defence
Department: Department Of Defence Production
Organisation: Hindustan Aeronautics Limited (hal)

Technical Evaluation Results

S.No. Seller Name Offered Item Participated On MSE/MII Status Status
1 MICROPACK PRIVATE LIMITED Make : NA Model : CPU PCB - C106.17. 5601 Title : CPU PCB - C106.17. 5601 06-05-2024 10:39:42 MII MSE Qualified
2 TECH NID SOLUTIONS Make : TECHNID SOLUTIONS Model : CUSTOM Title : CUSTOM 27-04-2024 13:13:36 MII MSE Qualified

Financial Evaluation Results

S.No. Seller Name Offered Item Total Price Rank
1 TECH NID SOLUTIONS(MSE,MII)( MSE Social Category:General ) Item Categories : CPU PCB - C106.17. 5601, LAYERS - 16, THIKNESS - 2.20 mm, GRADE - LCSO, MATERIAL - TU 872LK, FINISH 505660.17 L1
2 MICROPACK PRIVATE LIMITED (MSE,MII)( MSE Social Category:General ) Item Categories : CPU PCB - C106.17. 5601, LAYERS - 16, THIKNESS - 2.20 mm, GRADE - LCSO, MATERIAL - TU 872LK, FINISH 647784.07 L2

Bid on the next cpu pcb tender

Most bids fail on paperwork. Before the next one opens, we'll check your eligibility and get your registrations, digital signature (DSC) and documents ready.

GeM registration How to file a tender

Similar tenders

Search other tenders

WhatsApp Get tenders like this