Tender Details
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About Tender
💻 Procurement Opportunity: Cpu Pcb Manufacturing 🔧 The Department Of Defence Production Within The Ministry Of Defence Is Seeking Bids For The Supply Of Cpu Pc Bs (C106.17. 5601) With Specific Technical Specifications. 📋 📅 Bid Submission Deadline: April 27, 2024, 3:00 Pm The Pc Bs Must Have 16 Layers, A Thickness Of 2.20 Mm, Be Of Lcso Grade, Made Of Tu 872 Lk Material, And Have The Specified Finish. Interested Vendors Should Submit Detailed Bids That Meet The Outlined Requirements And Adhere To The Stipulated Timelines. Keywords: Cpu Pcb, C106.17. 5601, Layers, Thickness, Grade, Material, Finish, Defence Production, Ministry Of Defence, Procurement Tender| Particulars | Details |
|---|---|
| Title |
Cpu Pcb C106.17. 5601, Layers 16, Thikness 2.20 Mm, Grade Lcso, Material Tu 872 Lk, Finish
|
| Description |
|
| Organisation | Department of Defence Production | Ministry of Defence |
| Tender Id | GEM/2024/B/4868654 |
|
Reference Number |
- |
| Tender Fee | - |
| EMD | - |
| Tender Value | - |
| Place | |
| Link |
View Original Tender Notice
https://bidplus.gem.gov.in/all-bids |
| Start Date | April 17, 2024 19:49 |
| End Date |
Expired
27/04/2024
Expired 899 days ago |
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Award of Contract & Bid Results
Tender Status:
active
Ministry:
Ministry Of Defence
Department:
Department Of Defence Production
Organisation:
Hindustan Aeronautics Limited (hal)
Technical Evaluation Results
| S.No. | Seller Name | Offered Item | Participated On | MSE/MII Status | Status |
|---|---|---|---|---|---|
| 1 | MICROPACK PRIVATE LIMITED | Make : NA Model : CPU PCB - C106.17. 5601 Title : CPU PCB - C106.17. 5601 | 06-05-2024 10:39:42 | MII MSE | Qualified |
| 2 | TECH NID SOLUTIONS | Make : TECHNID SOLUTIONS Model : CUSTOM Title : CUSTOM | 27-04-2024 13:13:36 | MII MSE | Qualified |
Financial Evaluation Results
| S.No. | Seller Name | Offered Item | Total Price | Rank |
|---|---|---|---|---|
| 1 | TECH NID SOLUTIONS(MSE,MII)( MSE Social Category:General ) | Item Categories : CPU PCB - C106.17. 5601, LAYERS - 16, THIKNESS - 2.20 mm, GRADE - LCSO, MATERIAL - TU 872LK, FINISH | 505660.17 | L1 |
| 2 | MICROPACK PRIVATE LIMITED (MSE,MII)( MSE Social Category:General ) | Item Categories : CPU PCB - C106.17. 5601, LAYERS - 16, THIKNESS - 2.20 mm, GRADE - LCSO, MATERIAL - TU 872LK, FINISH | 647784.07 | L2 |
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