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| Particulars | Details |
|---|---|
| Title |
1.1 Mm Thick 8 Inch Diameter Silicon Epi Ready Wafers With (111) Orientation
|
| Description |
|
| Organisation | Department of Electronics and Information Technology | Ministry of Electronics and Information Technology |
| Tender Id | GEM/2023/B/3804680 |
|
Reference Number |
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| Tender Fee | |
| EMD | |
| Tender Value | |
| Place | |
| Link |
View Original Tender Notice
https://gem.gov.in/ |
| Start Date | August 09, 2023 15:07 |
| End Date |
Expired
30/08/2023
Expired 1011 days ago |
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Procurement of spares for inspection of sluice gate enclosure and bottom ash hopper and nozzle casing with nozzle tip of ceramic lining for 8 inch jet pump assembly of ahp, unit 10 and 11 stps, sarni.
Procurement of spares for inspection of sluice gate enclosure and bottom ash hopper and nozzle casing with nozzle tip of ceramic lining for 8 inch jet pump assembly of ahp, unit 10 and 11 stps, sarni.
Read moreEpi ready 150mm silicon 111 wafer 1mm thickness and epi ready 150mm silicon 111 wafer
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Silicon carbide paper 8 inch diameter grit 80,silicon carbide paper 8 inch diameter grit 120,silico
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7/8 inch diameter (22.2 mm dia)lock bolt
For complete deion and other details, please refer to tender
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