Feasibility Study For Etching And Hermetic Sealing Of Cavities In Thick Silicon Wafer In Presence Of Buffer Gases

Particulars	Details
Title	Feasibility Study For Etching And Hermetic Sealing Of Cavities In Thick Silicon Wafer In Presence Of Buffer Gases
Description	Feasibility Study For Etching And Hermetic Sealing Of Cavities In Thick Silicon Wafer In Presence Of Buffer Gases
Organisation	Defence eProcurement Portal
Tender Id	2023_DRDO_608075_1
Reference Number	SSPL/MMG/SBM/B/R/23-24/042
Tender Fee	0
EMD	59333
Tender Value	0
Place	SSPL (ONLINE)
Link	View Original Tender Notice https://defproc.gov.in
Start Date	July 08, 2023 00:00
End Date	Expired 27/07/2023 Expired 1179 days ago Search Similar tenders?

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