Closed 27 Jul 2023
Feasibility study for Etching and Hermetic sealing of Cavities in Thick Silicon Wafer in presence of buffer gases
Defence eProcurement Portal · SSPL (ONLINE)
- Tender value
- ₹0
- EMD
- ₹59,333
- Tender fee
- ₹0
This tender closed on 27 Jul 2023.
Tender details
- Tender ID
- 2023_DRDO_608075_1
- Reference number
- SSPL/MMG/SBM/B/R/23-24/042
- Organisation
- Defence eProcurement Portal
- Location
- SSPL (ONLINE)
- Bids open
- 7 Jul 2023, 6:30 PM
- Bids close
- 27 Jul 2023, 2:00 PM
- Tender value
- ₹0
- EMD
- ₹59,333
- Tender fee
- ₹0
Source: https://defproc.gov.in
Bid on the next feasibility study tender
Most bids fail on paperwork. Before the next one opens, we'll check your eligibility and get your registrations, digital signature (DSC) and documents ready.